Miyachi Unitek has developed a process for high quality precision laser cutting and laser micromachining of metals under 0.5mm thick using a fiber laser marker with high speed XY galvo beam delivery. This cost effective process offers both laser cutting and laser drilling capabilities and is particularly suited for cutting thin, reflective materials like gold or copper.  Typical applications for this laser cutting process include micro-electronics, semiconductors, and solar cells/grids. It is also useful for cutting prototype lead frames or other thin sheet metal parts with an underside burr of less than 0.0005”.

This laser cutting process does not require assist gas, but a low pressure flow of gas can be used to protect the optics to direct particulate matter away from the workpiece.