Thermodes for Benchtop Reflow Soldering & Bonding Heads


  • Wide Variety of Tip Shapes and Sizes
  • Uniform Heating
  • Dimensionally Stable


Miyachi Unitek's three-dimensional (TD) family of thermodes are designed for use with Miyachi Unitek SA Series reflow soldering heads.  

Utilized for a number of different reflow soldering and bonding applications, they feature:

  • Uniform temperature distribution across the thermode face
  • Retain optimal flatness under heating
  • Eliminate voltage potential, and have
  • Extremely fast heating and cooling to optimize process times








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